... . Darko Belavič is the corresponding author and can be contacted at: darko.Belavič@ijs.si 12 12 2016 20 02 2017 21 02 2017 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only LTCC Piezoelectric Packaging A number...

...Yang Liu; Fenglian Sun; Cadmus A. Yuan; Guoqi Zhang Purpose – The purpose of this paper is to discuss the possibility of using soldering process for the bonding of chip-on-flexible (COF) light-emitting diode (LED) packages to heat sinks. The common bonding materials are thermal conductive...

...). Mondher Chaoui can be contacted at: mondher.chaoui@enis.rnu.tn © Emerald Group Publishing Limited 2012 Microelectronics Packaging Power transmission systems Integrated circuits Amplifiers Micro‐circuit technology In implantable biomedical devices such as neuromuscular stimulators...

...Liyu Yang; Joseph Bernstein Purpose The purpose of this paper is to describe key failure mechanisms observed during the development of the advanced packaging technology. Extensive accelerated stress tests are conducted to collect failure data and understand failure characteristics and failure...

...Ping Yang; Zixia Chen Purpose The purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging and to investigate the dynamic behavior of PBGA assembly by considering fixed‐modes...

...Liyu Yang; Rui Niu; Jinsong Xie; Bin Qian; Baishi Song; Qingan Rong; Joseph Bernstein Purpose In today's electronic package development cycle, activities are managed by multiple participants in the supply chain, which might have different quality and reliability impacts to the end product...

...John Lau; Ricky Lee; Matthew Yuen; Philip Chan Purpose The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach These packages consist of the multi‐LEDs and active IC chip such as the application...

...J. Zhang; M. Li; C.Y. Xiong; J. Fang; S. Yi Purpose The mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental evaluation of the thermal stresses and strains in those electronic...

...C.Y. Xiong; J. Zhang; M. Li; J. Fang; S. Yi In this paper, two transform methods, the Fourier transform (FT) and the wavelet transform (WT) methods, are utilized to process moiré fringes for the strain analysis of electronic packaging. With the introduction of fringe carriers, those transform...

... that results from the mismatch in the coefficient of thermal expansion between the silicon chip and the substrate. The adhesion of the encapsulant to the chip and the board coating are essential to the reliability of the package. This paper studies the adhesion characteristics of an encapsulant to a flip chip...

... © MCB UP Limited 2003 --> MEMS Packaging Newport announces advanced automation for MEMS packaging Keywords: MEMS, Packaging Newport Corporation has announced the availability of advanced tools for automating the manufacturing of micro-electro-mechanical systems...

... © MCB UP Limited 2003 --> Microelectronics Packaging Foldable Flex and Thinned Silicon Chips for Multichip Packaging John Balde (Ed.)Kluwer Academic Publishers, Boston, USAISBN 0-7923-7676-5December 2002340 pp. Hardbound200 (Figures and Tables)Price: EURO 187.00/USD...

...Bob Willis © MCB UP Limited 2003 --> Packaging This is a very good reference source and I look forward to seeing how well it does in the marketplace. It is ideal for people who are new to this fascinating area of microsystems. It is not detailed in any one area but an ideal...

... © MCB UP Limited 2003 --> Semiconductors Packaging Assembly New small dot dispensing system for semiconductor and optical packaging and assembly Keywords: Semiconductors, Packaging, Assembly Asymtek has introduced a system especially designed for dispensing...

...Marko Pavlin; Darko Belavic; Marina Santo Zarnik; Marko Hrovat; Matej Mozek Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three...

... © MCB UP Limited 2002 --> IMAPS Packaging Keywords: IMAPS, Packaging October 8-11, 2002 * Hotel Bethlehem – Bethlehem, Pennsylvania This event offer four days of Technical Programming featuring the following sessions – Optoelectronics overview, Assembly...

... The Technical Program Committee of EMPC 2003 invites abstracts of unpublished work describing recent developments in Micro- electronics and Packaging. Topics include, but are not limited to: Materials and Technologies(Thick/Thin film, LTCC, Advanced PCBs, MCMs,FlipChip, CSP, COB, SMT...

... © MCB UP Limited 2002 --> Keyword: Packaging Transmission speeds in optical networks have been increasing rapidly since the 1980's, with OC-3 rates of 155Mb/s becoming quickly replaced by OC-12(622Mb/s), OC-48 (2.5Gb/s) and the now commonplace OC-192 (10Gb/s) transmission speed...

... © MCB UP Limited 2000 --> CS2 EV Group Bumping Packaging CS2 and EV Group reveal bumping technology relationship Keywords CS2, EV Group, Bumping, Packaging EV Group (EVG), Austria and Custom Silicon Configuration Services (CS2),Belgium announced today that CS2...

... © MCB UP Limited 2000 --> IMAPS Packaging "Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium Keywords IMAPS, Packaging IMAPS has announced a Call for Papers for its "International symposium on advanced packaging...