... Y ρ ( 1 − ν 2 ) LTCC Piezoelectric Packaging A number of piezoelectric vibrating devices, such as resonators, energy harvesters, ultrasonic generators and detectors, microbalances, tuneable elements, pumps, valves and various sensors are used in electronics...

...Yang Liu; Fenglian Sun; Cadmus A. Yuan; Guoqi Zhang Purpose – The purpose of this paper is to discuss the possibility of using soldering process for the bonding of chip-on-flexible (COF) light-emitting diode (LED) packages to heat sinks. The common bonding materials are thermal conductive...

...Liyu Yang; Joseph Bernstein Purpose The purpose of this paper is to describe key failure mechanisms observed during the development of the advanced packaging technology. Extensive accelerated stress tests are conducted to collect failure data and understand failure characteristics and failure...

... to 16 mm) between both coils. Mondher Chaoui can be contacted at: mondher.chaoui@enis.rnu.tn Microelectronics Packaging Power transmission systems Integrated circuits Amplifiers Micro‐circuit technology In implantable biomedical devices such as neuromuscular stimulators, cochlear...

...Ping Yang; Zixia Chen Purpose The purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging and to investigate the dynamic behavior of PBGA assembly by considering fixed‐modes...

...Liyu Yang; Rui Niu; Jinsong Xie; Bin Qian; Baishi Song; Qingan Rong; Joseph Bernstein Purpose In today's electronic package development cycle, activities are managed by multiple participants in the supply chain, which might have different quality and reliability impacts to the end product...

...John Lau; Ricky Lee; Matthew Yuen; Philip Chan Purpose The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach These packages consist of the multi‐LEDs and active IC chip such as the application...

...J. Zhang; M. Li; C.Y. Xiong; J. Fang; S. Yi Purpose The mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental evaluation of the thermal stresses and strains in those electronic...

...C.Y. Xiong; J. Zhang; M. Li; J. Fang; S. Yi In this paper, two transform methods, the Fourier transform (FT) and the wavelet transform (WT) methods, are utilized to process moiré fringes for the strain analysis of electronic packaging. With the introduction of fringe carriers, those transform...

... that results from the mismatch in the coefficient of thermal expansion between the silicon chip and the substrate. The adhesion of the encapsulant to the chip and the board coating are essential to the reliability of the package. This paper studies the adhesion characteristics of an encapsulant to a flip chip...

... © MCB UP Limited 2003 --> Microelectronics Packaging Foldable Flex and Thinned Silicon Chips for Multichip Packaging John Balde (Ed.)Kluwer Academic Publishers, Boston, USAISBN 0-7923-7676-5December 2002340 pp. Hardbound200 (Figures and Tables)Price: EURO 187.00/USD...

... © MCB UP Limited 2003 --> MEMS Packaging Newport announces advanced automation for MEMS packaging Keywords: MEMS, Packaging Newport Corporation has announced the availability of advanced tools for automating the manufacturing of micro-electro-mechanical systems...

... New small dot dispensing system for semiconductor and optical packaging and assembly Keywords: Semiconductors, Packaging, Assembly Asymtek has introduced a system especially designed for dispensing ultra-small dots of conductive epoxy. The Axiom™ X-1010 dispenser,configured...

...Bob Willis © MCB UP Limited 2003 --> Packaging Rao R. TummalaMcGraw Hill22 chapters, 923 pp., glossary,illustrations and photographs Keywords: Packaging It has been over 10 years since the first microelectronics packaging handbook from the pen of Rao Tummala...

... © MCB UP Limited 2002 --> IMAPS Packaging Keywords: IMAPS, Packaging October 8-11, 2002 * Hotel Bethlehem – Bethlehem, Pennsylvania This event offer four days of Technical Programming featuring the following sessions – Optoelectronics overview, Assembly...

... © MCB UP Limited 2002 --> IMAPS Microelectronics Packaging Keywords: IMAPS, Microelectronics, Packaging The Technical Program Committee of EMPC 2003 invites abstracts of unpublished work describing recent developments in Micro- electronics and Packaging. Topics...

...Marko Pavlin; Darko Belavic; Marina Santo Zarnik; Marko Hrovat; Matej Mozek Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three...

... For more information regarding this important strategic study, please contact Sarah Demmon, Direct Marketing Manager on +44 (0) 1306 875500 or e-mail at s.demmon@bpaconsulting.com At BPA, we believe that the development of photonic packages creates many opportunities within...

... © MCB UP Limited 2000 --> CS2 EV Group Bumping Packaging CS2 and EV Group reveal bumping technology relationship Keywords CS2, EV Group, Bumping, Packaging EV Group (EVG), Austria and Custom Silicon Configuration Services (CS2),Belgium announced today that CS2...

... © MCB UP Limited 2000 --> IMAPS Packaging "Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium Keywords IMAPS, Packaging IMAPS has announced a Call for Papers for its "International symposium on advanced packaging...