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Keywords: Packaging industry,Electronics industry
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2006) 23 (3)
Published: 01 September 2006
... with a comprehensive reliability programme to give end-users higher confidence in the use of these components in demanding applications. © Emerald Group Publishing Limited 2006 --> Packaging industry,Electronics industry MCE takes lead in developing “chip on board” reliability criteria...
