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Journal Articles
Microelectronics International (2012) 29 (3): 163–171.
Published: 27 July 2012
...Sung Yi; Tatiana M. Lam Purpose The purpose of this paper is to provide a design and material selection guideline for a plastic ball grid array (PBGA) package in order to improve its reliability and manufacturing ability after post mold cure. Design/methodology/approach Numerical experiments...
Journal Articles
Microelectronics International (2006) 23 (3): 67.
Published: 01 September 2006
... can but recommend it, despite the occasional error. Raymond A.   Higgins . Materials for Engineers and Technicians 4th ed. . Newnes, Oxford , , ISBN: 0‐7506‐6850‐4 400 pp. © Emerald Group Publishing Limited 2006 --> Metallurgy Plastics Commercial publications...

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