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Keywords: Polymerization
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (2): 39–43.
Published: 01 August 1999
... Chip scale packaging Encapsulation Flip chip Polymerization Thermoplastics Underfill The Packaging Revolution of the 1990s continues to introduce the most significant and rapid changes yet seen in the electronics industry. While the shift from feed‐through component assembly...
