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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2001) 18 (2): 31–34.
Published: 01 August 2001
...David K. Anderson; John Oleksyn; Martin Batson; John Cocker Thick printing Cu and Ag conductors have been developed specifically for use in power applications where excellent printing, thermal, electrical, wire bonding and soldering properties are prerequisite. Efficient thermal management can...
