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Keywords: Pressure
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Journal Articles
D. Spicer, K. Lai, K. Kornelsen, A. Brennan, N. Belov, M. Wang, T‐K. Chou, J. Heck, T. Zhu, S. Akhlaghi
Journal:
Microelectronics International
Microelectronics International (2010) 27 (3): 135–139.
Published: 03 August 2010
...D. Spicer; K. Lai; K. Kornelsen; A. Brennan; N. Belov; M. Wang; T‐K. Chou; J. Heck; T. Zhu; S. Akhlaghi Purpose The purpose of this paper is to characterize pressure non‐uniformity in a wafer‐to‐wafer bond chamber using pressure sensitive paper. Design/methodology/approach Pressure non...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2002) 19 (3): 9–13.
Published: 01 December 2002
...Marko Pavlin; Darko Belavic; Marina Santo Zarnik; Marko Hrovat; Matej Mozek Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three...
