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Keywords: Random vibration
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Journal Articles
Shaoyi Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, Chenghui Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Zhixian Min, Daxing Zhang, Congsi Wang
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 140–151.
Published: 12 January 2023
... properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model. Findings The results revealed...
