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Keywords: Redistribution layer
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Journal Articles
Journal:
Microelectronics International
Microelectronics International 1–8.
Published: 25 December 2025
... memory integration. For the edge AI chips with lightweight computing power, very thin FBGA ( VFBGA ), low power double data rate 5/5X (LPDDR5/5X) and wafer-level ( WL ) packaging with the redistribution layer ( RDL )-first process are the integration technology trends. This paper focuses on AI...
