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Keywords: Rework
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2001) 18 (1)
Published: 01 April 2001
... The availability of the new Model 870 attachment for removing flip chips that have been bonded using the new reworkable underfill materials (made by such manufacturers as Loctite, Emerson & Cuming and IBM) successfully culminates a year-long development effort at SEC during which time...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (1)
Published: 01 April 2000
...Professor Nihal Sinnadurai © MCB UP Limited 2000 --> Microelectronics Measurement Rework Discovering a heroic connection Keywords: Microelectronics, Measurement, Rework A visit to Bucharest to give an invited talk on Microelectronics Education led...
