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Keywords: SEC
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2001) 18 (1)
Published: 01 April 2001
... © MCB UP Limited 2001 --> SEC Rework Underfill Bonder attachment for reworking underfilled flip chips Keywords: SEC, Rework, Underfill Semiconductor Equipment Corporation (SEC) has announced the completion of development and commercial availability...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> SEC Lasers Bonding SEC introduces new laser diode bonder Keywords SEC, Lasers, Bonding Semiconductor Equipment Corporation today announced the availability of a new bonder designed specifically for laser diode bonding applications...
