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Keywords: SEC
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2001) 18 (1)
Published: 01 April 2001
... The availability of the new Model 870 attachment for removing flip chips that have been bonded using the new reworkable underfill materials (made by such manufacturers as Loctite, Emerson & Cuming and IBM) successfully culminates a year-long development effort at SEC during which time...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> SEC Lasers Bonding SEC introduces new laser diode bonder Keywords SEC, Lasers, Bonding Semiconductor Equipment Corporation today announced the availability of a new bonder designed specifically for laser diode bonding applications...
