SEC introduces new laser diode bonder
SEC introduces new laser diode bonder
Keywords SEC, Lasers, Bonding
Semiconductor Equipment Corporation today announced the availability of a new bonder designed specifically for laser diode bonding applications.
Designated the Model 860 Omni laser diode bonder (Plate 1), the table top system has a placement accuracy of ±5µm and is designed to handle low volume production runs.
The new laser diode bonder's internal PC controls have been programmed to minimize the line operator's required involvement, and minimum and simplified screen display menus make it easy for the line operator to work through process set-up tasks and to handle machine cycling.
The Model 860 Omni laser diode bonder features a rapid heat-up stage and servo-controlled voice coil-driven ultra-fine linear scrub head. It has a heated die tool and proform tool. The straight forward and aft scrub motion of the ultra fine linear scrub head is precisely controlled with return to the starting location specified to within microns. The amplitude, frequency and duration of the scrub motion are adjustable. The bonder comes equipped with a direct viewing stereo zoom microscope with 10× eye pieces on a pivoting mount and a high quality fiber optic illuminator that ensures uniform viewing. A single nozzle hot gas heater for spot heating the laser diode bond area may also be added.
SEC's new bonder comes equipped with a color CCD video camera and 14" color monitor for enhanced viewing. A micrometer stage is used to adjust the substrate in X, Y and theta for alignment with the die. Movement of the system's sliding table is controlled by a joystick. Pneumatic brakes lock the table in position.
Price of the new Model 860 Omni laser diode bonder ranges from $52,000 to $65,000, depending on options chosen. Delivery is eight weeks.
