... New Z motion control design permits precisely controlled die bond loads Keywords Semiconductor Equipment, Die bonding Semiconductor Equipment Corporation has also announced that it has perfected a design for Z motion control on its semiautomatic Model 410 flip chip bonder and Model...

... © MCB UP Limited 2001 --> Semiconductor Equipment Laser bonding New VCSEL alignment features added to SEC laser bonders Keywords Semiconductor Equipment, Laser bonding Semiconductor Equipment Corporation has announced the availability of two new features, a video...

... Limited 1999 --> Bonding Flip chip Semiconductor Equipment New bond load option adds to flip chip bonder's versatility Keywords Bonding, Flip chip, Semiconductor Equipment Semiconductor Equipment Corporation have announced the availability of an optional four-kilogram bond...