... Maximilian Huber (see Plate 1) will take over responsibility for Europe as Head of Sharp Microelectronics Division in Hamburg. Maximilian Huber has been appointed as Division General Manager at Sharp Microelectronics Division (MED) in Hamburg as of July. With this move, the Japanese company...

... The newly developed three-chip stacked CSP is based on Sharp technology using special thin silicon wafer layers and especially modified die and wire bonding. Three individual chips are arranged in a stacked structure within a single package, with the result that products can be made lighter...