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Keywords: SiP
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 152–158.
Published: 07 February 2023
...Hui Xiao; Xiaotong Guo; Fangzhou Chen; Weiwei Zhang; Hao Liu; Zejian Chen; Jiahao Liu Purpose Traditional nondestructive failure localization techniques are increasingly difficult to meet the requirements of high density and integration of system in package (SIP) devices in terms of resolution...
