...Mirosław Gracjan Gierczak; Eugeniusz Prociów; Andrzej Dziedzic Purpose This paper aims to focus on the fabrication and characterization of mixed thin-/thick-film thermoelectric microgenerators, based on magnetron sputtered constantan (copper–nickel alloy) and screen-printed silver. To improve...

.../methodology/approach The tested devices were fabricated as screen‐printed planar structures consisting of a silver back contact, a silver/silver chloride interfacial layer and a final salt reservoir layer containing potassium chloride. The fabrication parameters varied included deposition method...

... Pressure Substrates Gold Silver Wafer‐to‐wafer bonding has become an enabling semiconductor technology in industries such as 3D packaging, micro‐electro‐mechanical systems (MEMS), micro‐opto‐electro‐mechanical systems and silicon‐on‐insulator. In a typical wafer bonding process, two flat...

...Govind Umarji; Supriya Ketkar; Ranjit Hawaldar; Suresh Gosavi; Kashinath Patil; Uttam Mulik; Dinesh Amalnerkar Purpose The purpose of this paper is to ascertain chemical changes occurring at various stages involved in processing of silver‐based photoimageable thick films; and to determine ensuing...

.... This paper describes the advancements made in optimizing the performance of thick printing copper and silver conductors designed for use in power applications and their role in this demanding technology. The features of the materials, process guidelines, and performance characteristics will be discussed...