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Keywords: Solder ball
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (1): 14–18.
Published: 18 January 2013
.... Because the solder balls are too small for direct measurement of their stresses, finite element method (FEM) was used for obtaining the stresses instead. Design/methodology/approach This paper will discuss the results of the thermal stress distribution using numerical method via ABAQUS software...
