Keywords: Solder pastes
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Journal Articles
Microelectronics International (1999) 16 (3): 39–42.
Published: 01 December 1999
...‐array, were included. The finest pitch was 175µm with a pad size of 75µm. The test chips were designed in two sizes: 5.5 × 5.5mm2 and 11 × 11mm2. Printed circuit boards Flip chip on board Surface mount technology Solder pastes For decades, printed...
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