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Keywords: Solder pastes
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3): 39–42.
Published: 01 December 1999
...‐array, were included. The finest pitch was 175µm with a pad size of 75µm. The test chips were designed in two sizes: 5.5 × 5.5mm2 and 11 × 11mm2. Printed circuit boards Flip chip on board Surface mount technology Solder pastes For decades, printed...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3): 46–53.
Published: 01 December 1999
... Microwaves Solder pastes Insertion and return losses of filters in various tech‐nological versions were measured by using vector network analyser and then compared to the computed characteristics. Physical analyses of thick‐film layers such as cross‐sectioning, roughness and edge definition...
