... © MCB UP Limited 2000 --> F&K Delvotec Testing Bonding New automatic pulltester from F&K Delvotec Keywords F&K Delvotec, Testing, Bonding The new automatic pulltester complements the die and wire bonders from F&K. The PC controlled moving table...

... © MCB UP Limited 2000 --> Du Pont Testing Screen printing Du Pont provides its electronics customers with the "big screen" treatment Keywords Du Pont, Testing, Screen printing DuPont Microcircuit Materials has significantly extended the capabilities of its...

... BP Microsystems Inc. has introduced the BP-350 Parallel Wafer Tester and Programmer. The BP-350 (Plate 3) is designed to test and program Flash, EPROMs, EEPROMs,and Microcontrollers in the wafer and packaged part stages at a higher through-put – up to three times higher – than traditional...

... MRSI Die bonding Testing Eutectic solder MRSI 505 opens eutectic die attach lab facility Keywords MRSI, Die bonding, Testing, Eutectic solder Electronics manufacturers assembling microwave, optical and RF modules, as well as other advanced packages requiring eutectic die...

... © MCB UP Limited 2000 --> Mini-Systems Testing Thick film Keywords Mini-Systems, Testing, Thick film The thick film division of Mini-Systems, Inc., which is certified to Life Failure Rate "S" for MIL-PRF-55342 fixed film, resistor chip performance specification, has...

... © MCB UP Limited 2000 --> Dage Testing Dage launches new low-force wire pull tester Keywords: Dage, Testing Aimed primarily at production testing applications in the semiconductor industry, the new SERIES-3000 low-force wire pull tester from Dage Precision...

...V. Székely; M. Rencz; B. Courtois Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently,thermal issues need to be considered during both design and test. The present paper...

... variation. Experimental variables include card thickness, ball pad size on the card ball grid array (BGA) site, module moisture exposure and ball planarity of a 225 I/O PBGA. Another set of PBGA test cards, assembled under optimum process conditions, was subjected to accelerated thermal cycle (ATO) testing...