...Xuexia Yang; Miao Zhu; Yanxi Sun; Jinbao Lin; Xin Hao; Xuefeng Shu; Gesheng Xiao Purpose The purpose of this study is to investigate the influence of intermetallic compound ( IMC ) layer thickness on the reliability of plastic ball grid array ( PBGA ) lead-free solder joints under thermal cycling...

... properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model. Findings The results revealed...

... Reliability modelling Thermal cycling High density chip scale package discussed in this article is a substrate‐less chip packaging technology that offers a low cost package with high density and high performance. In the package construction, silicon chips are arranged then encapsulated in the panel...

...Dhafer Abdul Ameer Shnawah; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Suhana Said Purpose The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions, and further modification...

...Milos Dusek; Ivan Szendiuch; Petr Szuscik Investigates the influence of land pattern pad designs and solder volume on reliability of solder joint attachments for surface mounted passive chip devices. All boards were thermal cycled and periodically tested to induce a damage mechanism in less time...