Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-2 of 2
Keywords: Thermal efficiency
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Thermal analysis of LED package
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2006) 23 (1): 19–25.
Published: 01 January 2006
... in achieving fast and accurate result in thermal modeling of LED package and also offers solutions on reducing the LED thermal resistance. © Emerald Group Publishing Limited 2006 Light‐emitting diodes Thermal efficiency Simulation Light emitting diode (LED) technology has evolved from...
Journal Articles
Thermal degradation of joined thick Au and Al elements
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2004) 21 (1): 31–34.
Published: 01 April 2004
.... © Emerald Group Publishing Limited 2004 Thermal efficiency Electrical resistivity In electronic circuit assembly Au‐Al type bonds are still widely used. Apart from many advantages the negative side of joining these metals is connected with diffusion and easy formation...
