K.N. Seetharamu
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Journal Articles

Test chip and substrate design for flip chip microelectronic package thermal measurements

Teck Joo Goh, Chia‐Pin Chiu, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal
Journal: Microelectronics International
Microelectronics International (2006) 23 (2): 3–10.
https://doi.org/10.1108/13565360610669959
Published: 01 May 2006
View article titled, Test chip and substrate design for flip chip microelectronic package thermal measurements
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Journal Articles

Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life

K.O. Lee, K.E. Ong, K.N. Seetharamu, I.A. Azid, G.A. Quadir, T.J. Goh
Journal: Microelectronics International
Microelectronics International (2006) 23 (2): 37–44.
https://doi.org/10.1108/13565360610659707
Published: 01 May 2006
View article titled, Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
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Journal Articles

Thermal analysis of LED package

N. Aizar Abdul Karim, P.A. Aswatha Narayana, K.N. Seetharamu
Journal: Microelectronics International
Microelectronics International (2006) 23 (1): 19–25.
https://doi.org/10.1108/13565360610642714
Published: 01 January 2006
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Journal Articles

Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms

K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid
Journal: Microelectronics International
Microelectronics International (2005) 22 (3): 3–15.
https://doi.org/10.1108/13565360510610486
Published: 01 December 2005
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Journal Articles

Optimization of fins used in electronic packaging

Kang Eu Ong, Kor Oon Lee, K.N. Seetharamu, I.A. Azid, G.A. Quadir, Z.A. Zainal, Teck Joo Goh
Journal: Microelectronics International
Microelectronics International (2005) 22 (1): 10–15.
https://doi.org/10.1108/13565360510575495
Published: 01 April 2005
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Journal Articles

Thermal investigations of microelectronic chip with non‐uniform power distribution: temperature prediction and thermal placement design optimization

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. Jeevan Ganeshamoorthy
Journal: Microelectronics International
Microelectronics International (2004) 21 (3): 29–43.
https://doi.org/10.1108/13565360410549701
Published: 01 December 2004
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Journal Articles

Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. Jeevan
Journal: Microelectronics International
Microelectronics International (2004) 21 (2): 29–35.
https://doi.org/10.1108/13565360410531999
Published: 01 August 2004
View article titled, Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach
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