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Thermal investigations of microelectronic chip with non‐uniform power distribution: temperature prediction and thermal placement design optimization

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. Jeevan Ganeshamoorthy

Microelectronics International (2004) 21 (3): 29–43.

https://doi.org/10.1108/13565360410549701

Published: 01 December 2004

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