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Journal Articles

Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms

K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid
Journal: Microelectronics International
Microelectronics International (2005) 22 (3): 3–15.
https://doi.org/10.1108/13565360510610486
Published: 01 December 2005
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Journal Articles

Thermal investigations of microelectronic chip with non‐uniform power distribution: temperature prediction and thermal placement design optimization

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. Jeevan Ganeshamoorthy
Journal: Microelectronics International
Microelectronics International (2004) 21 (3): 29–43.
https://doi.org/10.1108/13565360410549701
Published: 01 December 2004
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Journal Articles

Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. Jeevan
Journal: Microelectronics International
Microelectronics International (2004) 21 (2): 29–35.
https://doi.org/10.1108/13565360410531999
Published: 01 August 2004
View article titled, Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach
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