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Keywords: Thermal expansion
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2012) 29 (3): 163–171.
Published: 27 July 2012
... (1MPa∼15GPa) and the coefficient of thermal expansion (CTE) (10ppm∼300ppm) are evaluated to see feasibility of a new class of material set in the molding compound. Effects of thermo‐mechanical properties of selected molding compound on the warpage and residual stress of the PBGA are analyzed...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2010) 27 (1): 21–24.
Published: 26 January 2010
...Montasser S. Tahat Purpose The purpose of this paper is to investigate the effect of SiC addition up to 60 percent SiC on the mechanical properties and thermal expansion of Al‐7vol.% Si/SiC composites. Design/methodology/approach Composite specimens containing 7, 15, 30, 45 and 60 vol...
