... Ablestik Laboratories introduces a new thermoplastic adhesive film designed to provide temporary attach for MR or GMR head wafer fabrication. ABLEFILM™WF5802E electrically conductive adhesive provides electrostatic discharge (ESD)protection during ion milling and reactive etching of MR and GMR...

... Chip scale packaging Encapsulation Flip chip Polymerization Thermoplastics Underfill The Packaging Revolution of the 1990s continues to introduce the most significant and rapid changes yet seen in the electronics industry. While the shift from feed‐through component assembly...

... variety of substrate materials has led to an increasing interest in thermoplastic adhesive technology. Thermoplastics are not always the best solution for every application. This paper sets out to address the “pros and cons” of each polymer technology for different microelectronic applications taking...

... to the use of epoxy itself. Another route being developed in a joint programme between Multicore Solders Ltd and Diemat, Inc.,is based on thermoplastic polymers and offers benefits in the areas of reworkability, low modulus, low joint stress and possibly environmental stability. The novel process...