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Keywords: Through-glass vias
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2020) 37 (4): 181–188.
Published: 03 August 2020
...Omar Ahmed; Golareh Jalilvand; Scott Pollard; Chukwudi Okoro; Tengfei Jiang Purpose Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate...
