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Keywords: Through-silicon via
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Journal Articles
Analysis of misalignment-induced deformation in three-dimensional semiconductor chip stacks
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 61–70.
Published: 29 April 2014
...Richard W. Johnson; Yu-Lin Shen Purpose – The purpose of this study is to numerically assess the misalignment-induced deformation and its implications, in the through-silicon via (TSV), silicon chip, solder micro-bump, and bonding layer. Design/methodology/approach – The 3D finite element...
