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Keywords: Tin contamination
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 176–186.
Published: 26 July 2013
... on ball bonding (Chuang et al., 2006 ; Nowful and Lok, 2001 ; Park et al., 2007 ; Petzold et al., 2000) while few on the effects on stitch bonding (Lin et al., 2002). Tin contamination PQFN package Wire bondability Bond integrity Contamination solution...
