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Keywords: Unitive
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Unitive Flip chip Bumping Keywords Unitive, Flip chip, Bumping Unitive Advanced Semiconductor Packaging announces the release to manufacturing of a low alpha count flip chip bumping process for both eutectic(63/37) and high-lead (95/5) solder...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Amkor Technology Unitive Licensing Flip chip Keywords Amkor Technology, Unitive, Licensing, Flip chip Amkor Technology, Inc. and Unitive Advanced Semiconductor Packaging have signed a ten-year technology transfer and licensing agreement...
