Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-3 of 3
Keywords: Vibration
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Dynamic reliability approach of chip scale package assembly under vibration environment
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 71–77.
Published: 29 April 2014
...Ping Yang; Xiusheng Tang; Yu Liu; Shuting Wang; Jianming Yang Purpose – The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong fatigue life of CSP assembly are provided...
Journal Articles
Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2012) 29 (2): 71–75.
Published: 04 May 2012
...Guangbin Tan; Ping Yang; Tianbo Li; Tao Xi; Xiaoming Yuan; Jianming Yang Purpose The purpose of this paper is to provide a systematic method to perform analysis and test for vibration‐thermal strain behavior of plastic ball grid array (PBGA) assembly by considering thermal and vibration loading...
Journal Articles
Parameters affecting the sensitivity of LTCC pressure sensors
Available to PurchaseGoran J. Radosavljević, Walter Smetana, Andrea M. Marić, Ljiljana D. Živanov, Michael Unger, Günther Stangl
Journal:
Microelectronics International
Microelectronics International (2010) 27 (3): 159–165.
Published: 03 August 2010
... in the graph of Figure 8 . Goran J. Radosavljević can be contacted at: rgoran@uns.ac.rs © Emerald Group Publishing Limited 2010 Vibration Sensors Sensitivity analysis Modeling Simulation The considered sensor operating principle is based on a passive resonant LC circuit. Sensors...
