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Keywords: Wafer warpage
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2019) 36 (4): 150–159.
Published: 27 September 2019
... on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded...
