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Keywords: Wafer-level packaging
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Journal Articles
Journal:
Microelectronics International
Microelectronics International 1–8.
Published: 25 December 2025
... layer Wafer-level packaging To solve the above problems, one solution transforms the traditional organic substrate into highly integrated fan-out (InFO) wafer level packaging (FOWLP) that uses thin redistribution layers (RDLs), reduced dielectric thickness, narrow trace lines and microvias. Since...
