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Keywords: Wire bondability
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 176–186.
Published: 26 July 2013
... analysis assisted with argon ion sputter detected that there was a tin layer thicker than 20 nm coated on the bonding surface and the wire bondability of gold wire on this tin coating was poor; the lead frame was redesigned to prevent the wetting and flowing of tin and got a perfect performance...
