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Journal Articles
Multidiscipline Modeling in Materials and Structures (2022) 18 (1): 87–94.
Published: 23 November 2021
... element analysis Package type Over the past few decades, ball grid array (BGA) technologies have been very popular in manufacturing electronics packages because of the advantages of high Input/Output (I/O) density, small package size and cost-effectiveness (Lau, 1995 ; Borgesen et al...
