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Volume 23, Issue 1
1 March 2003
This article was originally published in
Assembly Automation
Assembly Automation Cover Image for Volume 23, Issue 1
Research Article| March 01 2003

Breaking the bond

Publisher: Emerald Publishing
Online ISSN: 1758-4078
Print ISSN: 0144-5154
© MCB UP Limited
2003
Assembly Automation (2003) 23 (1): 36–37.
https://doi.org/10.1108/01445150310460060

This paper outlines a new technology for creating adhesive bonds that can be broken at end‐of‐life. Also describes its potential application in the automotive industry, particularly for glazing application.

Keywords: Automotive industry, Assembly, Adhesives, Recycling
© MCB UP Limited
2003
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