Machine vision in the electronics industry

Focuses on the utilization of machine vision in three areas of electronic assembly. Looks at odd‐shaped component placement covering part location, target location and placement. Discusses LCD display inspection, including LCD, LED and Plasma technologies. Also examines machine vision in automated die and wire bond inspection for multi‐chip module manufacturing. Considers the benefits of automating inspection processes and concludes by looking at how useful measurements can be extracted from the analysis of images of wire bonds.