This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. In this system, to allow close monitoring of magnitude and direction of microforces (adhesion, surface tension, friction, and assembly forces) acting on microdevices during assembly, the PVDF polymer films are used to fabricate the highly sensitive 1D and 2D sensors, which can detect the real‐time microforce and force rate information during assembly processes. This technology has been successfully used to perform a tele‐assembly of the surface MEMS structures with force/visual feedback via Internet between USA and Hong Kong. Ultimately, this E‐manufacture system will provide a critical and major step towards the development of automated micromanufacturing processes for batch assembly of microdevices.
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Research Article|
September 01 2004
Internet‐based remote assembly of micro‐electro‐mechanical systems (MEMS)
Yantao Shen;
Yantao Shen
Department of Electrical and Computer Engineering, Michigan State University, Michigan, USA
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Ning Xi;
Ning Xi
Department of Electrical and Computer Engineering, Michigan State University, Michigan, USA
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King W.C. Lai;
King W.C. Lai
Center for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China
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Wen J. Li
Wen J. Li
Center for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China
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Publisher: Emerald Publishing
Online ISSN: 1758-4078
Print ISSN: 0144-5154
© Emerald Group Publishing Limited
2004
Assembly Automation (2004) 24 (3): 289–296.
Citation
Shen Y, Xi N, Lai KW, Li WJ (2004), "Internet‐based remote assembly of micro‐electro‐mechanical systems (MEMS)". Assembly Automation, Vol. 24 No. 3 pp. 289–296, doi: https://doi.org/10.1108/01445150410549782
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