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After a shaky and possibly over‐hyped start in the early 1980s, surface‐mount technologies are beginning to find favour with many electronics‐assembly houses. Undoubtedly they are addressing a market demand to make products smaller, lighter, and possibly cheaper. Suddenly SMT placement and soldering equipment no longer looks so expensive, or at least, it is becoming easier to justify capital expenditure on it in terms of increased throughput and flexibility.

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