Pulse-heated micro-joining system ideal for flexible applications
Pulse-heated micro-joining system ideal for flexible applications
Keywords Assembly,Electronics
A new pulse-heated reflow system, ideal for joining flexible circuits to PCBs, is now available from Townsend Coates. By allowing precise control of temperature and pressure, plus highly uniform distribution of heat, the product will greatly assist in improving process control and production yield (see Plate 5).
Designed to address the requirements of miniaturisation, such as flex-to-PCB and flex-to-flex connection, the Uniflow system, from Unitek, implements a proven micro-joining process in which a special soldering tool the thermode is used. This holds the parts together, adds heat (produced by an electrical current),melts the solder and retains the position as it cools. Ideal for production-oriented applications requiring, for example, selective soldering, or attaching heat-sensitive components which cannot withstand reflow oven temperatures, the technique allows very high levels of repeatability and throughput.
Plate 5 The Uniflow system from Unitek is available from Townsend Coates
The Uniflow system offers many clear advantages over conventional soldering devices. For example, because it heats the parts only very briefly (typically to 350°C), from the ambient temperature, there is minimum risk of heat damage. Further, the product uses a process which is designed to resolve the problems
The highly accurate control of pressure and temperature offered by the Uniflow means that it will be of use in a wide range of applications, such as where flexible circuits are used to connect LCD displays, communications components, automotive sensors and/or PCBs. This process may involve 20-200 connection points across connector widths of 10mm to 100mm, and intertrace pitches as tight as 50 microns and, while such applications depend heavily on precision hand soldering, they can be effectively and efficiently joined using a controlled-feedback selective soldering system such as the Uniflow. The product will also be extremely useful in conductive adhesive bonding applications, where the control of pressure is critical, if damage to fragile underlying substrates (such as glass) is to be avoided.
To enable the Uniflow to be integrated into an automated assembly process, rotary bonding tables are also available. The device also features an integral control I/O interface and a serial (RS232C) port for uploading data for SPC analysis.
For further information contact: Eddie James, Townsend Coates, Lunsford Road, Leicester LE5 0HH, UK. Tel: +44 (0) 116 274 4488.
