Keywords: Electronics
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Journal Articles
Journal Articles
Assembly Automation (2003) 23 (1)
Published: 01 March 2003
... © MCB UP Limited 2003 --> Assembly Electronics New Assembléon component placer the total solution for semicon production Keywords: Assembly, Electronics Assembléon launches a new semiconductor component placement machine which delivers an unbeatable speed...
Journal Articles
Assembly Automation (2002) 22 (4)
Published: 01 December 2002
... © MCB UP Limited 2002 --> Materials Alloys Electronics Osprey ce alloys meet market demands Keywords: Materials, Alloys, Electronics A specially formulated range of controlled expansion (CE) alloys produced by Osprey Metals Ltd is meeting the demands...
Journal Articles
Assembly Automation (2002) 22 (2)
Published: 01 June 2002
... Assembly Electronics Keywords: Assembly, Electronics © MCB UP Limited 2002 --> Anza Technology of Roseville, CA has introduced its new Model 275, the first thoroughly ESD protected, manual to fully automatic, high resolution tabletop bonder available under $55,000...
Journal Articles
Assembly Automation (2002) 22 (1)
Published: 01 March 2002
... Electronics Assembly New SMT placement systems from Assembléon enhance speed, flexibility and ease of use Keywords: Electronics, Assembly Increased speed and high accuracy make new component mounting systems from Assembléon very attractive to electronics manufacturers...
Journal Articles
Assembly Automation (2001) 21 (3)
Published: 01 September 2001
... © MCB UP Limited 2001 --> Electronics Assembly Cognex Cognex Corporation introduces next-generation vision system for surface mount industry Keywords: Electronics, Assembly, Cognex Cognex, a leading supplier of machine vision systems to the semiconductor...
Journal Articles
Assembly Automation (2001) 21 (3)
Published: 01 September 2001
.... It is supplied complete with all accessories, fittings and input hoses, storage, stand and consumable components. © MCB UP Limited 2001 --> Intertronics Electronics Assembly Product development New fully-featured benchtop dispenser ensures accuracy and consistency Keywords...
Journal Articles
Assembly Automation (2001) 21 (2)
Published: 01 June 2001
... © MCB UP Limited 2001 --> Electronics Manufacturing Agile production An agile solution to product shortages Keywords Electronics, Manufacturing, Agile production Persistent component shortages that prevent electronics manufacturers –from makers of set-top boxes...
Journal Articles
Assembly Automation (2001) 21 (1)
Published: 01 March 2001
... © MCB UP Limited 2001 --> Electronics Adhesives Education Adhesives in electronics network launches offensive in the field of education Keywords: Electronics, Adhesives, Education Cross-European professional education for adhesive technology in electronics...
Journal Articles
Assembly Automation (2000) 20 (4)
Published: 01 December 2000
... Electronics New £1.4M PCB assembly centre open and ready to "REACT" Keywords: Electronics Electronics industry companies now have a powerful new source of technical back-up available in the North East, where TWI's Regional Electronics Assembly Centre (REACT) is fully...
Journal Articles
Assembly Automation (2000) 20 (1)
Published: 01 March 2000
... © MCB UP Limited 2000 --> Safety Electronics Samsung officially listed "world's safest workplace" Keywords: Safety, Electronics Guinness Book of World Records chairman Christopher Irwin has officially presented Samsung Electronics with a certificate...
Journal Articles
Assembly Automation (2000) 20 (1)
Published: 01 March 2000
... © MCB UP Limited 2000 --> Electronics Phase change Phase control Keywords: Electronics, Phase change Applicant: Pierre Raimbault (FR)Patent number: US5923251Publication date: 13 July 1999 Title: Phase control method for electronic tags and station and tag...
Journal Articles
Assembly Automation (2000) 20 (1)
Published: 01 March 2000
... © MCB UP Limited 2000 --> Electronics Resonant labels Keyword: Electronics Applicant: Flexcon Co. Inc. (US)Patent number: US5920290Publication date: 6 July 1999 Title: Resonant tag labels and method of making the same The invention relates to resonant...
Journal Articles
Assembly Automation (1999) 19 (4)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Machine vision Electronics Keywords Machine vision, Electronics Scientific Generics, the Cambridge-based technology and business consultancy,has developed a new system for inspecting surface-mount printed-circuit boards. The semi-automatic...
Journal Articles
Assembly Automation (1999) 19 (4)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Electronics Assembly Keywords Electronics, Assembly TWI has just launched a £1.4 million project to build a centre of excellence promoting best practice in printed circuit board (PCB) assembly techniques and training. Based at TWI North...
Journal Articles
Assembly Automation (1999) 19 (2)
Published: 01 June 1999
... © MCB UP Limited 1999 --> Electronics XYFLEX multi-head dispensing technology launched in Northern Europe Keyword Electronics CAM/ALOT Speedline Technologies announces the development of the fastest, most flexible liquid dispensing system on the market ­ three...
Journal Articles
Assembly Automation (1999) 19 (1)
Published: 01 March 1999
... © MCB UP Limited 1999 --> Electronics Part presentation Semiconductor bonding needs fast and accurate positioning Keywords Electronics,Part presentation Die bonding in the electronics industry, in which tiny silicon chips are secured to their substrate, requires...
Journal Articles
Journal Articles
Assembly Automation (1998) 18 (4)
Published: 01 December 1998
... © MCB UP Limited 1998 --> Assembly Electronics Pulse-heated micro-joining system ideal for flexible applications Keywords Assembly,Electronics A new pulse-heated reflow system, ideal for joining flexible circuits to PCBs, is now available from Townsend Coates...
Journal Articles
Assembly Automation (1997) 17 (1): 66–74.
Published: 01 March 1997
...David C. Whalley; Samjid H. Mannan; David J. Williams Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using anisotropic conductive adhesive materials. The experimental configurations...

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