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Keywords: Heat
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Journal Articles
Journal:
Robotic Intelligence and Automation
Assembly Automation (2002) 22 (1)
Published: 01 March 2002
... © MCB UP Limited 2002 --> Semiconductors Assembly Heat New thin bondline, thermal interface material – low thermal resistance with high integrity Keywords: Semiconductors, Assembly, Heat New from INTERTRONICS is an innovative thermal interface material...
