The goal of this review paper is to provide information on several commonly used thermography techniques in semiconductor and micro‐device industry and research today.
The temperature imaging or mapping techniques include thin coating methods such as liquid crystal thermography and fluorescence microthermography, contact mechanical methods such as scanning thermal microscopy, and optical techniques such as infrared microscopy and thermoreflectance. Their principles, characteristics and applications are discussed.
Thermal issues play an important part in optimizing the performance and reliability of high‐frequency and high‐packing density electronic circuits. To improve the performance and reliability of microelectronic devices and also to validate thermal models, accurate knowledge of local temperatures and thermal properties is required.
The paper provides readers, especially technical engineers in industry, a general knowledge of several commonly used thermography techniques in the semiconductor and micro‐device industries.
