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Volume 33, Issue 3
17 May 2021
Soldering & Surface Mount Technology Cover Image for Volume 33, Issue 3
Research Article| November 16 2020

Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

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Noor H. Jabarullah can be contacted at: nhafidzah@unikl.edu.my and Nisith Geetha can be contacted at: nisith.geetha@gmail.com
Publisher: Emerald Publishing
Received: June 24 2020
Revision Received: October 04 2020
Accepted: October 09 2020
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© Emerald Publishing Limited
2020
Emerald Publishing Limited
Licensed re-use rights only
Soldering & Surface Mount Technology (2021) 33 (3): 187–194.
https://doi.org/10.1108/SSMT-06-2020-0028
Article history
Received:
June 24 2020
Revision Received:
October 04 2020
Accepted:
October 09 2020
Purpose

This paper aims to establish a more accurate model for lifetime estimation.

Design/methodology/approach

Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.

Findings

A more precise model was found.

Originality/value

It is confirmed that the paper is original.

Keywords: Electronic devices, Creep strain, Strain energy density, Temperature profile
© Emerald Publishing Limited
2020
Emerald Publishing Limited
Licensed re-use rights only
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