Retraction notice: Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads

The publisher of Soldering & Surface Mount Technology wishes to retract the article Supriyono, Chen T., Yapanto L.M., Latipov Z.A., Zekiy A.O., Melnikova L.A., Thangavelu L., Surendar A., Repnikov N.I. and Arzehgar Z. (2022), “Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads”. Soldering & Surface Mount Technology, Vol. 34 No. 1 pp. 58–65, doi: Link to Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loadsLink to the cited article. It has come to our attention that there are concerns regarding the authorship, provenance, and review of the article; as a result, the article’s findings cannot be relied upon. The decision to retract has been informed by Link to COPE’s guidelines on retractionsLink to the cited article and Link to Emerald’s publishing ethicsLink to the cited article. Emerald’s authorship policy guidelines make it clear that authorship is a fundamental aspect of transparency in the publication process and ensures accountability and responsibility for reported research. The authors cooperated with the investigation but failed to address the concerns identified sufficiently; it should be noted that multiple contact addresses provided to the publisher on submission are now invalid for several of the co-authors. The publisher of the journal sincerely apologizes to the readers.