MRSI's ENCore offers Dual Lane Encapsulation

MRSI's ENCore offers Dual Lane Encapsulation

Keywords Encapsulation, MRSI

Encapsulation has gone dual lane with MRSI's new ENCore Dual Lane Encapsulation systems. ENCore systems offer the continuous processing benefits of dual lane processing for advanced packaging and assembly encapsulation applications including Die Coat, Dam &Fill, Glob Top, Chip Underfill, Cavity Fill, and more (Plate 2).

ENCore systems are compact and modular, offering high throughput in a smaller footprint. Because they are modular, they are expandable into multi-unit systems. For example, the ENCore 1x is a dual lane single-head or dual-head system, depending on the process; add a second ENCore system, and you have an ENCore 2x ­ two lanes, two systems,twice the productivity.

 Plate 2 Encore Systems are compact and modular

The high-precision ENCore's ergonomic design, coupled with its sophisticated control and process monitoring system, offers a number of unique features including complete process monitoring, on or off-line programming, self-diagnostic software, and a powerful and user-friendly Windows NT environment.

For more information about the MRSI ENCore, contact MRSI at 25 Industrial Avenue, Chelmsford, Massachusetts 01824, USA. Tel: +1 (978) 256-4950; Fax: +1 (978) 256-5120; E-mail: sales@mrsigroup.com