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MV Technology launches new FX-B benchtop measurement system

Keywords: MV Technology, Measurement

MV Technology Ltd has launched the new FX-B bench-top flux inspection and measurement system for process set-up or off-line process control for BGA, CSP or flip chip flux component manufacturing.

The FX-B is a compact version of the market – proven FX-10, and utilizes the patent-pending UV fluorescence intensity mapping (UV FIM) process to produce a digital image of the flux deposits on a substrate. This image is obtained and analyzed by a computer to map the topographical details of each deposit.

The FX-B contains a complete imaging system that enables users to manually place substrates onto the viewing tray and obtain intensity-mapped images of flux deposits to determine:

  • area coverage of pads;

  • volume of deposits;

  • height of deposits;

  • deformed deposits;

  • placement offsets of each deposit.

Options include:

  • SPC toolkit;

  • 2D solder paste measurement;

  • 2D solder ball measurement.

This flexible bench-top unit can be used in multiple modes. Manual; the inspection is limited to a user-defined rectangular area within the image. Semi-automatic; areas of interest can be highlighted using the GUI and stored into a file for subsequent inspections. Automatic; CAD data minimizes setup and teaching time.

For further information: Tel: +3531 6718177; Fax: +3531 671 8470; E-mail: marketing@mvt.ie; Web site: http://www.mvt.ie

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