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One part of putting a new wave solder machine into service is determining the optimum settings for the machine's operating parameters. Generally this is done on the basis of ‘common’ knowledge or by simply using whatever settings were used on the old machine. In this case, a full factorial statistical experiment was designed and performed to determine the optimum settings for conveyor speed, board topside temperature and solder pot temperature. Using this technique it was possible to determine the size and shape of the optimum processing ‘window’ by constructing contour plots from the data. The experiment was repeated for a different assembly to determine the sensitivity of the parameter settings to board thickness and component density.
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© MCB UP Limited
1989
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