Finite element modelling of printed circuit boards (PCBs) for structural analysis Available to Purchase

Considers a process for better mechanical design of printed circuit boards (PCBs) which suffer from warpage during the assembly process. During the reflow process, PCBs experience a wide range of temperatures, i.e. from ambient temperature to the peak temperature reached in the furnace. Out‐of‐plane deflections are generated, due to the mismatch in the thermal expansion properties of the materials comprising the PCB. In this study, the focus is on setting up the analysis procedure and constructing a finite element model of the board deflections. The weight of the components mounted on the PCB and the effect of soldering are ignored, due to the complexity of the additional data required. A set of real PCBs was also exposed to the reflow process and the resulting deflection measured for comparison with the model. The combination of properties of the board material and copper plating is further researched in order to investigate the cause of problems and improve design.