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Volume 13, Issue 1
1 April 2001
Soldering & Surface Mount Technology Cover Image for Volume 13, Issue 1
Review Article| April 01 2001

Tin pest in lead‐free solders

Yoshiharu Kariya;
Yoshiharu Kariya
Materials Engineering Department, The Open University, Milton Keynes, UK
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Colin Gagg;
Colin Gagg
Materials Engineering Department, The Open University, Milton Keynes, UK
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William J. Plumbridge
William J. Plumbridge
Materials Engineering Department, The Open University, Milton Keynes, UK
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
2001
Soldering & Surface Mount Technology (2001) 13 (1): 39–40.
https://doi.org/10.1108/09540910110361730

Considers the effect of low temperatures on the characteristics of lead‐free alloys based upon tin, which is the most popular basis for the new alloys.

Keywords: Lead‐free soldering, Tin, Reliability
© MCB UP Limited
2001
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