A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic SnPb solder on both top and bottom of the ball. A closed‐form solution, based on the calculation of the equilibrium of the displacements within the electronic package assembly, was first derived in order to calculate the solder joint strains during temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution for the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials. A fatigue life prediction model was established.
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1 August 2004
Research Article|
August 01 2004
CBGA solder joint thermal fatigue life estimation by a simple method Available to Purchase
T.E. Wong;
T.E. Wong
Raytheon Electronic Systems, El Segundo, California, USA
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C.Y. Lau;
C.Y. Lau
Raytheon Electronic Systems, El Segundo, California, USA
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H.S. Fenger
H.S. Fenger
Raytheon Electronic Systems, El Segundo, California, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© Emerald Group Publishing Limited
2004
Soldering & Surface Mount Technology (2004) 16 (2): 41–45.
Citation
Wong T, Lau C, Fenger H (2004), "CBGA solder joint thermal fatigue life estimation by a simple method". Soldering & Surface Mount Technology, Vol. 16 No. 2 pp. 41–45, doi: https://doi.org/10.1108/09540910410537327
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